| 一、表面粗糙化： | ||
| 1 |
1/6 - ( A ) WPI / DERWENT |
EP1271665 NOVELTY |
| 2 |
3/6 - ( A ) WPI / DERWENT |
GB2311413 |
| 3 |
4/6 - ( A ) WPI / DERWENT |
DE19537544 |
| 4 |
6/6 - ( A ) WPI / DERWENT |
EP-404565 |
|
二、芯片外形： | ||
| 5 |
1/21 - ( A ) WPI / DERWENT |
EP1331673 NOVELTY |
| 6 |
4/21 - ( B ) WPI / DERWENT |
US2002017652 NOVELTY |
| 7 |
5/21 - ( A ) WPI / DERWENT |
FR2809534 NOVELTY |
| 8 |
7/21 - ( A ) WPI / DERWENT |
WO200205358 NOVELTY |
| 9 |
9/21 - ( A ) WPI / DERWENT |
WO200203477 NOVELTY |
| 10 |
10/21 - () WPI / DERWENT |
WO200161765 NOVELTY |
| 11 |
15/21 - ( A ) WPI / DERWENT |
GB2326023 |
| 12 |
16/21 - ( A ) WPI / DERWENT |
EP-766324 |
|
三、衬底剥离： | ||
| 13 |
1/15 - ( A ) WPI / DERWENT |
US2003032210 NOVELTY |
| 14 |
3/15 - ( A ) WPI / DERWENT |
US2002034835 NOVELTY |
| 15 |
4/15 - ( A ) WPI / DERWENT |
WO200219439 NOVELTY |
| 16 |
5/15 - ( A ) WPI / DERWENT |
WO200182384 NOVELTY |
| 17 |
7/15 - ( A ) WPI / DERWENT |
EP1065734 NOVELTY |
| 18 |
8/15 - ( A ) WPI / DERWENT |
EP1059662 NOVELTY |
| 19 |
9/15 - ( A ) WPI / DERWENT |
CN1262528 NOVELTY |
| 20 |
10/15 - ( A ) WPI / DERWENT |
GB2346480 NOVELTY |
| 21 |
11/15 - ( A ) WPI / DERWENT |
GB2346479 NOVELTY |
|
四、划片、裂片： | ||
| 22 |
1/19 - ( A ) WPI / DERWENT |
DE10102315 NOVELTY |
| 23 |
3/19 - ( A ) WPI / DERWENT |
EP1223625 NOVELTY |
| 24 |
4/19 - ( A ) WPI / DERWENT |
WO200256365 NOVELTY |
| 25 |
8/19 - ( A ) WPI / DERWENT |
JP11251265 NOVELTY |
| 26 |
9/19 - ( A ) WPI / DERWENT |
GB2322737 |
| 27 |
10/19 - ( A ) WPI / DERWENT |
WO9807190 |
| 28 |
14/19 - ( A ) WPI / DERWENT |
US5418190 |
| 29 |
17/19 - ( A ) WPI / DERWENT |
EP-341034 |
| 30 |
18/19 - ( A ) WPI / DERWENT |
DE3731312 |
|
五、电极 | ||
| 31 |
3/36 - ( A ) WPI / DERWENT |
US2002074556 NOVELTY |
| 32 |
5/36 - ( A ) WPI / DERWENT |
DE10048196 NOVELTY |
| 33 |
9/36 - ( A ) WPI / DERWENT |
EP1168460 NOVELTY |
| 34 |
12/36 - ( A ) WPI / DERWENT |
DE10017758 NOVELTY |
| 35 |
22/36 - ( A ) WPI / DERWENT |
WO9834285 |
| 36 |
23/36 - ( A ) WPI / DERWENT |
EP858114 |
| 37 |
27/36 - ( A ) WPI / DERWENT |
J09298313 |
| 38 |
30/36 - ( A ) WPI / DERWENT （ Ni/Au ） |
J09064337 |
| 39 |
35/36 - (C) WPI / DERWENT |
EP622858 |
| 40 |
36/36 - (C) WPI / DERWENT |
EP-579897 |
|
六、蚀刻 | ||
| 41 |
1/11 - ( A ) WPI / DERWENT |
US2003042496 NOVELTY |
| 42 |
2/11 - ( A ) WPI / DERWENT |
WO200175952 NOVELTY |
| 43 | 11/11 - ( A ) WPI / DERWENT | |
|
七、光子晶体 | ||
| 44 |
1/22 - ( A ) WPI / DERWENT |
JP2003215366 NOVELTY |
| 45 |
2/22 - ( A ) WPI / DERWENT |
US2003053790 NOVELTY |
| 46 |
13/22 - ( A ) WPI / DERWENT |
US6339030 NOVELTY |
| 47 |
17/22 - ( A ) WPI / DERWENT |
JP2001091777 NOVELTY |
| 48 |
19/22 - ( A ) WPI / DERWENT |
JP2000329953 NOVELTY |
| 49 |
20/22 - ( A ) WPI / DERWENT |
AB - JP2000121987 NOVELTY |
| 八、微结构 | ||
| 50 |
1/8 - ( A ) WPI / DERWENT |
WO200141219 NOVELTY |
| 51 |
6/8 - ( A ) WPI / DERWENT |
WO9641372 |
|
九、钝化 | ||
| 52 |
1/10 - ( A )) WPI / DERWENT |
US2003025121 NOVELTY |
| 53 |
6/10 - ( A ) WPI / DERWENT |
US6316820 NOVELTY |
芯片结构部分重要专利简介：芯片结构部分重要专利 关键字：|芯片结构部分重要专利|
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